AA-Bond 2156 Heat Conductive, Electrically Insulating, Thermally Conductive, 2 Part, 250gm kit

AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards. AA-BOND 2156 is two parts fast cure adhesive develops strong bond to many materials, and its coefficient of thermal expansion provides a good match for the application. GENERAL PROPERTIES Appearance Tan Cure Type Room temperature cure Benefits Fast cure Strong Durable High- impact bonds at room temperature that improves heat Mix Ratio by weight 100:23 / Resin:Hardener Operating Temperature -55 to 100 °C Typical Applications Fiber optic bundles, potting glass fibers and fiber optic connectors UNCURED PROPERTIES: Viscosity at 25 °C 12,000 ±1000 (After Mixing) Specific Gravity, mixed 2.26 Reactive solids contents, % 100 Pot Life 5 minutes CURE SCHEDULE: 1 hour at 25°C CURED PROPERTIES: Glass transition temperature (Tg), °C 33 Hardness, Shore D 79 Lap shear strength, psi 3400 (Alum to Alum) GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). AVAILABILITY: This epoxy can be supplied in various different packages.

• Spec. Gravity 2.26 g/cc Cured Viscosity 2,000 ±1000 After Mixing olids contents % 100 Pot Life 5 min
• Mechanical Properties Hardness, Shore D 79 Adhesive Bond Strength 3400 psi Lap shear 2 hrs At 65°C
• Maximum Service Temp, Air 212 °F min Service Temp, Air -94.0° F Glass Transition Temp, Tg 91.4 °F
• Color Tan
• Mix Ratio, parts by weight 100/23 Resin/Hardener